Systems and methods for detecting defects in printed solder paste

ABSTRACT

A method of analyzing an image of a substance deposited onto a substrate, the image comprising a plurality of pixels, includes defining a region of interest in the image, associating the region of interest with first and second perpendicular axis, wherein a set of pixels in the image lie along the first axis, converting the pixels in the region of interest to a single dimensional array aligned with the first axis and projecting along the second axis, and applying at least one threshold to the single dimensional array, the threshold based at least in part on a predetermined limit.

CLAIM OF PRIORITY

This application is a continuation-in-part of U.S. patent applicationSer. No. 09/304,699, entitled “A method and apparatus for inspectingsolder paste deposits on substrates”, the contents of which areincorporated herein by reference in their entirety.

FIELD OF THE INVENTION

Embodiments of the invention generally relate to devices, systems, andmethods used in machine vision systems. More particularly, the inventionrelates to systems and methods for detecting defects in the solder pasteprint process.

BACKGROUND OF THE INVENTION

In typical surface-mount circuit board manufacturing operations, astencil printer is used to print solder paste onto a circuit board.Typically a circuit board having a pattern of pads or some other usuallyconductive surface onto which solder paste will be deposited isautomatically fed into the stencil printer and one or more small holesor marks on the circuit board, called fiducials, is used to properlyalign the circuit board with the stencil or screen of the stencilprinter prior to the printing of solder paste onto the circuit board. Insome prior art systems, an optical alignment system is used to align thecircuit board with the stencil. Examples of optical alignment systemsfor stencil printers are described in U.S. Pat. No. 5,060,063, issuedOct. 21, 1991 to Freeman, and in U.S. Pat. No. Re. 34,615 issued Jan.31, 1992, also to Freeman, each of which is incorporated herein byreference.

The solder paste print operation can be a primary source of defects insurface mount assembly. Thus, processes have been developed to inspect asubstrate after solder paste has been deposited thereon to determinewhether the solder paste has been properly applied to conductive padslocated on the substrate, usually, but not limited to, conduction padson a printed circuit board. For example, in some prior art systems, theoptical alignment system mentioned above also includes a visioninspection system to inspect the substrate.

Automated machine-based techniques for assessing print defects, however,are only able to isolate and quantify tangible characteristics. Reliablemethods are still needed to classify and weigh the significance of printdefects as they relate to the process, to provide meaningful output andto define realistic and useful process limits. Although subsequentprocesses certainly play a part in determining the quality of the finalprinted circuit board (PCB assembly), detection and accurate assessmentof bridge and other defects, as printed, can provide the most directfeedback for process control of appropriate print functions.

SUMMARY OF THE INVENTION

The existence of solder paste spanning a gap between adjacent pads, byitself, does not guarantee that a bridge-related defect will occur laterin the assembly process. Not all bridges or bridge-like defects have thenecessary mass or geometry to adversely affect a given process.Conversely, gap defects that actually are significant to a process maynot always connect adjacent pads to form a well-defined bridge. It hasbeen found that the significance of paste-in-gap defects is affected byfactors such as the total amount of paste forming a bridge or“bridge-like” feature, the geometry of a paste feature (e.g., length,width, proportions), and the total amount of paste in a gap, regardlessof its geometry.

In at least one embodiment, the invention provides systems and methodsthat can provide improved detection of solder paste defects such asbridges, to improve print process control. In this embodiment, thesystems and methods of the invention operate on a premise that not allbridge or “bridge-like” defects have the necessary mass or geometry toadversely affect a given process, and gap defects that are significantdon't always connect adjacent pads to form a bridge. Although subsequentprocesses also play a part in determining the quality of the finalassembly, detection and accurate assessment-of bridge and other defects,as printed, can, in at least one embodiment, provide direct feedback forprocess control of appropriate print functions.

In one embodiment, the invention-provides a method for analyzing gapdefects that provides reliable measurements of paste-in-gap area anddetects significant geometry and span of bridge-like paste features asthey relate to the SMT (surface mount technology) assembly process. Thetotal amount of paste in a gap and the effective span of bridge-likefeatures across the gap are used together to determine the probabilitythat a specific paste feature will cause a bridge-related defect.

In one embodiment the invention is directed to a method of analyzing animage of a substance deposited onto a substrate, the image comprising aplurality of pixels. The method includes defining a region of interestin the image, associating the region of interest with first and secondperpendicular axis, wherein a set of pixels in the image lie along thefirst axis, converting the pixels in the region of interest to a singledimensional array aligned with the first axis and projecting along thesecond axis, and applying at least one threshold to the singledimensional array, the threshold based at least in part on apredetermined limit.

Embodiments of the invention can include one or more of the followingfeatures. The method can include smoothing the single dimensional array.The method can further include the steps of computing, for each pixelalong the first axis, a sum of all the pixels in the region of interestthat are in perpendicular alignment with the respective pixel along theaxis, and representing the sums of each pixel along the axis as a singledimensional array perpendicular to the second axis.

Embodiments of the invention can further include the steps of locatingan axis substantially near one edge of the region of interest, wherein aset of pixels in the image lie along the axis and evaluating the singledimensional array to determine whether any features exist in the regionof interest. The features can include defects, short circuits,bridge-like features, bridges, excess quantities of the substance, strayareas of the substance, and poorly defined areas of the substance.

Other embodiments of the method of the invention include receiving atleast one detection parameter, the detection parameter relating todetermining the likelihood that the at least one feature in the imagecould later result in a functional defect. The step of evaluating can beaccomplished in accordance with the at least one detection parameter. Afurther embodiment of the invention can include computing, for eachfeature in the region of interest, the area and geometry of the feature,the computation accomplished at least in part using the detectionparameter and the single dimensional array. Still further embodimentscan include the step of determining, based on the area and geometry, thelikelihood that the at least one feature in the image could later resultin a functional defect.

Embodiments of the invention can include printed circuit boards as thesubstrates and an electrical material as the substance. Otherembodiments of the invention can include a substance that comprisessolder paste. The image can be comprised of a digitized image.

Implementations of the invention can include a method of inspecting asubstrate having a substance deposited thereon. The method includesdepositing the substance onto the substrate, capturing an image of thesubstrate, detecting variations in texture in the image to determine alocation of the substance on the substrate, defining a region ofinterest in the image, the defined region of interest having a firstaxis, wherein a set of pixels in the image lie along the axis,computing, for each pixel along the axis, a sum of all the pixels in theregion of interest that are in perpendicular alignment with therespective pixel along the axis, representing the sums of each pixelalong the axis as a single dimensional array perpendicular to the axis,and evaluating the single dimensional array to determine whether anyfeatures exist in the region of interest.

Other implementations of the invention include a system for dispensingsolder paste at predetermined locations on a substrate. The methodcomprises a dispenser that dispenses material on the substrate, acontroller for maintaining the operations of the dispenser, and aprocessor in electrical communication with the controller of theprocessor. The processor is programmed to perform texture-basedrecognition of a solder paste deposit located on the substrate, define aregion of interest within the image of solder paste, the defined regionof interest having a first axis, wherein a set of pixels in the imagelie along the axis, compute, for each pixel along the axis, a sum of allthe pixels in the region of interest that are in perpendicular alignmentwith the respective pixel along the axis, represent the sums of eachpixel along the axis as a single dimensional array perpendicular to theaxis, and evaluate the single dimensional array to determine whether anydefects exist in the region of interest.

Still further implementations of the invention are directed to a methodof detecting a defect in a substance deposited on a substrate. Themethod includes capturing an image of the substrate, detectingvariations in texture in the image to determine a location of thesubstance on the substrate, defining a region of interest in the image,the defined region of interest having a first axis, wherein a set ofpixels in the image lie along the axis, computing, for each pixel alongthe axis, a sum of all the pixels in the region of interest that are inperpendicular alignment with the respective pixel along the axis,representing the sums of each pixel along the axis as a singledimensional array perpendicular to the axis, and evaluating the singledimensional array to determine whether any defects exist in the regionof interest.

Embodiments of the invention can include one or more of the followingfeatures. The substance can be solder paste. The defect can comprise atleast one of a solder bridge, bridge-like feature, or excess pastefeature. The substrate can include first and second pads onto which thesolder is deposited and the defect can comprise the existence of solderpaste spanning at least a portion of the distance between the first andsecond pads. The method can further comprise applying a rule todetermine whether the defect should be classified as a solder bridge.

Details relating to this and other embodiments of the invention aredescribed more fully herein.

BRIEF DESCRIPTION OF THE FIGURES

The advantages and aspects of the present invention will be more fullyunderstood in conjunction with the following detailed description andaccompanying drawings, wherein:

FIG. 1A provides a front view of a stencil printer in accordance withone embodiment of the present invention;

FIG. 1B is a schematic of another embodiment of the present invention;

FIGS. 2A–2B is a schematic of a printed circuit board;

FIG. 3 is a flowchart of the method for-inspecting solder paste depositson a substrate;

FIGS. 4A–4B is a schematic of various regions within a processor thatutilizes the method of the invention;

FIGS. 5A–5C is a representation of various filters typically used in themethod of the invention;

FIG. 6 is a flowchart of a method that implements an automatic gainoffset feature of the invention;

FIGS. 7A–7B is a schematic representation of solder paste distributionson a printed circuit board;

FIGS. 8A–8H is a schematic of various kernel-configuration options forpaste texture spacing versus magnification;

FIGS. 9A–9D is a representation of experimental results from a systemthat utilizes an embodiment of the invention;

FIGS. 10A–10C is a comparison of raw images from a system that utilizesan embodiment of the invention without saturation;

FIGS. 11A–11C is a comparison of raw images from a system that utilizesan embodiment of the invention with saturation;

FIG. 12 is a histogram of experimental results from a system thatutilizes an embodiment of the invention;

FIG. 13 is a flowchart of a prior art process for inspecting solderpaste deposited on a substrate;

FIG. 14 is a greyscale image of paste acquired in the acquisition stepof FIG. 13;

FIG. 15 is a weighted paste only image of the grayscale image of FIG. 14as converted to a paste only image during the paste-only image step ofFIG. 13;

FIG. 16 is an RGB image of UV enhanced fluorescent paste acquired duringthe acquisition step of FIG. 13;

FIG. 17 is a binary paste only image of the RGB image of FIG. 16, asconverted to a paste only image during the paste-only image step of FIG.13;

FIG. 18 is a flowchart of a print defect detection sequence, inaccordance with one embodiment of the invention;

FIGS. 19A–19C are details of a run-time image with illustrative featuresindicated, in accordance with an embodiment of the invention;

FIGS. 20A–20C are details of a paste-only image of the respective imagesin FIGS. 19A–19C;

FIG. 21 is a flow chart of a process for bridge feature analysis, inaccordance with an embodiment of the invention;

FIG. 22 is a general block diagram illustrating the inputs and outputsof a system implemented in accordance with an embodiment of theinvention;

FIGS. 23A–23C are first illustrative run-time, paste-only, and projectedpaste only images of solder paste in a gap, processed in accordance withan embodiment of the invention;

FIGS. 24A–24D are second illustrative run-time, paste-only, region ofinterest, and projected paste only images of solder paste in a gap,processed in accordance with an embodiment of the invention;

FIGS. 25A–25C are third illustrative run-time, paste-only, and projectedpaste only images of solder paste in a gap, processed in accordance withan embodiment of the invention;

FIG. 26 is an illustration showing the effect of variations in pad sizeon gap size, in accordance with an embodiment of the invention;

FIG. 27 is an illustration showing the effect of variations in padposition on gap size, in accordance with an embodiment of the invention;

FIG. 28 is a first representative illustration showing types ofbridges/bridge-like features that may be detectable using one embodimentof the invention;

FIG. 29 is a second representative illustration showing types ofbridges/bridge-like features that may be detectable using one embodimentof the invention;

FIG. 30 is a third representative illustration showing types ofbridges/bridge-like features that may be detectable using one embodimentof the invention; and

FIG. 31 is a representative illustration of various types of screenprinting/solder paste printing defects that may be detectable inaccordance with at least some embodiments of the invention.

The drawings are not necessarily to scale, emphasis instead generallybeing placed upon illustrating the principles of the invention.

DETAILED DESCRIPTION

One embodiment of the present invention generally relates to a stencilprinter utilizing a method for conducting solder paste texturerecognition. This technique is used to acquire paste-only images ofprinted substrates, such as stencils and circuit boards, for use inanalyzing and thereafter preventing defects. For example, print defectsoften occur in the process of printing solder paste on a circuit boardusing a stencil printer. FIG. 1A shows a front view of a stencil printer100 in accordance with one embodiment of the present invention. Thestencil printer 100 includes a frame 12 that supports components of thestencil printer including a controller 108, a stencil 16, and adispensing head 118 having a dispensing slot 118 a from which solderpaste may be dispensed.

The dispensing head 118 is coupled to a first plate 18 using twothumbscrews 22. The first plate 18 is coupled to a second plate 20 whichis coupled to the frame 12 of the stencil printer 10. The first plate 18is coupled to the second plate 20 in such a manner that the first platecan be moved with respect to the second plate along a z-axis, the z-axisbeing defined by the coordinate axis system 23 shown in FIG. 1A. Thefirst plate is moved by motors under the control of the controller 108.

The second plate 20 is movably coupled to the frame 12 such that thesecond plate 20 can move with respect to the frame 12 along an x-axis,the x-axis also being defined by the coordinate axis system 23. Asdescribed below, the movements of the first and second plates allow thedispensing head 118 to be placed over the stencil 16 and moved acrossthe stencil to allow printing of solder paste onto a circuit board.

Stencil printer 100 also includes a conveyor system having rails 24 fortransporting a circuit board 102 to a printing position in the stencilprinter. The stencil printer has a number of pins 28, positioned beneaththe circuit board when the circuit board is in the dispensing position.The pins are used to raise the circuit board 102 off of the rails 24 toplace the circuit board in contact with, or in close proximity to, thestencil 16 when printing is to occur.

The dispensing head 118 is configured to receive two standard SEMCOthree ounce or six ounce solder paste cartridges 104 that provide solderpaste to the dispensing head 118 during a printing operation. Each ofthe solder paste cartridges 104 is coupled to one end of a pneumatic airhose 30. As readily understood by those skilled in the art, thedispensing head could be adapted to receive other standard, ornon-standard, cartridges. The other end of each of the pneumatic airhoses is attached to a compressor that under the control of thecontroller 108 provides pressurized air to the cartridges to forcesolder paste to flow from the cartridges into the dispense head 118 andonto the screen 16. Mechanical devices, such as a piston, may be used inaddition to, or in place of, air pressure to force the solder paste fromthe SEMCO cartridges into the dispensing head.

In one embodiment of the present invention, the controller 108 isimplemented using a personal computer using the Microsoft DOS orWindows® NT operating system with application specific software tocontrol the operation of the stencil printer as described herein.

The stencil printer 100 operates as follows. A circuit board 102 isloaded into the stencil printer using the conveyor rails 24. A machinevision process for automatically aligning the printed circuit board 102to stencil 16 is implemented. The printed circuit board 102 and stencil16 are brought into contact, or nearly so, prior to application of thesolder paste. The dispensing head 118 is then lowered in the z-directionuntil it is in contact with the stencil 16. Pressurized air is providedto the cartridges 104 while the dispensing head is moved in the xdirection across the stencil 16. The pressurized air forces solder pasteout the cartridges and creates pressure on the solder paste in thedispensing head forcing solder paste from the dispensing slot 118 a ofthe dispensing head 118 through apertures in the stencil 16 and onto thecircuit board 102. Once the dispensing head 118 has fully traversed thestencil 16, the circuit board 102 is lowered back onto the conveyorrails 24 and transported from the printer so that a second circuit boardmay be loaded into the printer. To print on the second circuit board102, the dispensing head 118 is moved across the stencil in thedirection opposite to that used for the first circuit board.Alternatively, a squeegee arm could swing in to contain the solder pastein the dispenser, and the dispenser can then be lifted in thez-direction and moved back to its original position to prepare to printon the second circuit board using a similar direction stroke.

As described further in U.S. Pat. No. 6,324,973 entitled “Method andApparatus for Dispensing Material in a Printer” filed on Jan. 21, 1999,assigned to Speedline Technologies, Inc., the assignee of the presentinvention and incorporated herein by reference, the dispensing head 118is lowered into a printing position so that it is in contact with thestencil. The stencil printer 100 operates by forcing solder paste fromthe dispensing head 118 onto the stencil using air pressure applied toeach of the SEMCO cartridges as the dispensing head moves across thestencil. In the printing position, two blades (not shown) come intocontact with the top surface of the stencil. For each direction that thedispensing head moves across the stencil, one of the blades will be atrailing blade and will scrape any excess solder paste off the stencil.

At the conclusion of printing, when it is desired to lift the dispensinghead 118 off of the stencil, the controller 108 turns off thepressurized air source, prior to lifting the dispensing head 118. Thiscauses the solder paste to remain in a chamber (not shown) when thedispensing head 118 is lifted and effectively reduces the amount ofsolder paste that is left on the stencil when printing is complete.

After the solder paste has been deposited onto the printed circuitboard, a machine vision process for automatically inspecting the printedcircuit board is implemented. In one embodiment of the presentinvention, the inspection process uses a texture recognition method todetermine whether solder paste has been properly deposited ontopredetermined contact regions located on the printed circuit board. Thesolder paste texture recognition system used in embodiments of thepresent invention will now be described.

Referring to FIG. 1B, a functional block diagram 101 of the screenprinter 100 is shown. In FIG. 1B, the screen printer 100 is showninspecting a substrate 102 having a substance 102 a deposited thereon.In one embodiment, the substrate 102 includes a printed circuit board,stencil, wafer, or any flat surface, and the substance 102 a includessolder paste.

FIG. 2A and FIG. 2B, show a top plan view of a printed circuit board 220which may be used in place of the substrate 102 in FIG. 1B. The printedcircuit board 220 has a region of interest 222 and contact regions 224.It also has traces 226 and vias 228. FIG. 2A shows the printed circuitboard 220 without solder paste deposits on any of the contact regions224. FIG. 2B shows solder paste deposits 228 distributed on thepredetermined contact regions 224 of the printed circuit board 220. Inthe printed circuit board 220, the predetermined areas 224 aredistributed across a designated region of interest 222 of the printedcircuit board 220.

FIG. 2B shows a misalignment of the solder paste deposits 230 withcontact pads 224. Each of the solder paste deposits 230 is partiallytouching one of the contact regions. However, to insure good electricalcontact and prevent bridging between pad regions (i.e. short circuits),solder paste deposits 230 should be aligned to contact pad regions 224within specific tolerances. An embodiment of the invention describedherein discloses a method using texture recognition to detect misalignedsolder paste deposit on contact pads, and as a result, generallyimproves the manufacturing yield of printed circuit boards.

Again referring to FIG. 1B, in one embodiment of the present invention,a method for solder paste texture recognition includes a step of using acamera 104 to capture an image of the substrate 102 having a substance102 a deposited thereon. In one embodiment, the camera 104 is acharge-coupled device that transmits a real-time analog signal 105 to aframe grabber 106. The real-time analog signal corresponds to an imageof the substrate 102 having the substance 102 a deposited thereon. Thecamera 104 may obtain an image of the substance 102 a using a rastertype scan, or an area scan of the substrate 102. In one embodiment, thecamera 104 is also able to image the bottom side of the substrate 102 orstencil 16 by using a combination of mirrors, beam splitters, or anothercamera.

The camera 104 transmits an analog signal 105 to a frame grabber 106.The analog signal 105 contains information regarding the image of thesubstrate 102 and the substance 102 a deposited thereon. The framegrabber 106 digitizes the analog signal 105 and creates a digitizedimage 105 a which may be displayed on a monitor 107. The digitized image105 a is divided into a predetermined number of pixels, each having abrightness value from 0 to 255 gray levels (in an 8-bit range). In oneembodiment of the invention, the analog signal 105 represents areal-time image signal of the substrate 102 and substance 102 adeposited thereon. However, in an alternative embodiment, a stored imageis transmitted from a memory device coupled to a controller 108.Furthermore, depending upon the camera 104, and other devices used toacquire the image of the substrate 102 and the substance 102 a, thebrightness values used could range from 0 to 65,535 gray levels (in a16-bit range).

The frame grabber 106 is electrically connected to the processor 116.The controller 108 includes a processor 116 and the frame grabber 106.The processor 116 calculates statistical variations in texture in theimage 105 a of the substance 102 a. The texture variations in the image105 a of the substance 102 a are calculated independent of relativebrightness of non-substance background features on the substrate 102, sothat the processor 116 can determine the location of the substance 102 aon the substrate 102, and to compare the location of the substance 102 awith a desired location. In one embodiment of the present invention, ifthe comparison between the desired location and the actual location ofthe substance 102 a reveals misalignment exceeding a predefinedthreshold, the processor 116 responds with adaptive measures to reduceor eliminate the error, and may reject the substrate or trigger an alarmvia the controller 108. The controller 108 is electrically connected tothe drive motors 120 of the stencil printer 100 to facilitate alignmentof the stencil and substrate as well as other motion related to theprinting process.

The controller 108 is part of a control loop 114 that includes the drivemotors 120 of the stencil printer 100, the camera 104, the frame grabber106, and the processor 116. The controller 108 sends a signal to adjustthe alignment of a stencil printer frame 12, and thus the mechanicallycoupled stencil 16, should the substance 102 a on the substrate 102 bemisaligned.

FIG. 3 shows a flowchart 300 of the method for inspecting solder pastedeposits on a substrate. Step 302 includes capturing an image 105 of asubstance deposited onto a substrate 102. In one embodiment, thesubstance 102 a is solder paste and the substrate 102 is a printedcircuit board. The image 105 a of the substrate 102 with a substance 102a deposited thereon may be captured in real-time or retrieved from acomputer memory. Step 304 includes sending the image 105 a to aprocessor 116. The remaining steps in the inspection method areperformed by the processor 116. Step 306 detects texture variations inthe image 105 a utilizing various texture sensitive operators describedbelow. The texture variations are used to determine the location of thesubstance 102 a on the substrate 102. In Step 308, the processor 116 isprogrammed to compare the texture variations at a particular locationwith texture features at predetermined locations of the substrate. InStep 310, if the variations are within predetermined limits, theprocessor 116 may respond with dynamic adaptive measures (Step 314) torefine the main process. If the variations lie outside predeterminedlimits, then Step 314 triggers appropriate recovery measures throughStep 312 to reject the substrate, terminate the process, or trigger analarm via controller 108. Related statistical process control (SPC) dataare recorded in step 316 along with other process data and is availablefor review and analysis both locally and via network access.

As mentioned above, detecting the variations of texture in the image 105a, and comparing the location and area of the substance 102 a with apredetermined location and area, utilizes a processor 116.

Processor Functions

The technique used by the processor 116 to recognize solder paste 228 ona printed circuit board 224 will now be described. In one embodiment ofthe present invention, the processor 116 performs four functions. Thefour functions are image enhancement, texture segmentation, imagelocation analysis, and process control.

As previously stated, existing solder paste inspection systems primarilyuse basic single or dual thresholding methods that only utilizedifferences in pixel brightness of the original image to identify solderpaste. In embodiments of the invention, the processor 116 also utilizessingle and dual thresholding techniques but on an image that ispre-processed using various texture sensitive operators such that singleand dual thresholds may be used to separate specific regions based onrelative texture, as in this case, to identify the location and area ofsolder paste deposits. The dual threshold technique is preferred sinceit provides a more accurate scalable transition at edge pixels or anyregion of uncertainty in the texture based image.

The texture sensitive operators utilized by the method of the inventioninclude a sharpening operator, a Laplacian operator, and a smoothingoperator that includes a boosting mechanism. Each of the operators willbe described as part of the processor functions.

Texture is a variation of brightness. In particular, texture refers tothe local variation in brightness from one pixel to another. Thus, ifbrightness is interpreted as the elevation in an image, then the textureis a measure of surface roughness.

In one embodiment of the present invention, a range operator may be usedto detect texture in image 105 a. The range operator represents thedifference between maximum and minimum brightness values in aneighborhood. The range operator converts the original image 105 a toone in which brightness represents the texture. Specifically, theoriginal brightness features disappear and different structural regionsare distinguished by the range brightness. The range operator may alsobe used to define edge boundaries of an image.

Another texture operator is represented by the variance in neighborhoodregions. In one embodiment of the invention, the processor is programmedto calculate the variance. The variance is essentially the sum ofsquares of the difference between the brightness of a central pixel andits neighbors. If the sum of squares is first normalized by dividing bythe number of pixels in the neighborhood, then this result representsthe root mean square (RMS) difference of values and corresponds to thesurface roughness. These texture sensitive operators and methods may beimplemented using rudimentary tools provided by software suppliers toeffectuate machine vision processes. These-processes are generallydiscussed by John C. Russ in “The Image Processing Handbook, SecondEdition”, and in the “Handbook of Computer Vision Algorithms in ImageAlgebra”, by Gerhard X. Ritter and Joseph N. Wilson which areincorporated herein by reference.

In one embodiment of the invention, the processor 116 is programmed toperform separate functions using the aforementioned texture sensitiveoperators. The operations performed by the processor 116 are logicallyrepresented in a functional block diagram shown in FIG. 4A, wherein theseparate operations are shown connected by an information bus 214 whichfacilitates sharing data between the functional blocks. The filteringsection 202 of the processor 116 performs a texture segmentationprocess. The acquisition section 206 of the processor 116 calculates thegain and offset required to provide a specific contrast and brightnessto enhance a run-time image 105 a. The analysis section 210 of theprocessor 116 performs location and contour analysis of the solder pasteregion 102 a on the substrate 102 and compares both to predeterminedparameters. The process control section 212 of the processor 116 is usedto minimize any aliasing in an image of the solder paste region 102 a.The following is a discussion of the performance of each of the variousfunctions of the processor 116.

The Filtering Section 202

In one embodiment of the invention, the filtering section 202 of theprocessor 116 performs image filtering utilizing a Laplacian filter 202Bshown in FIG. 4B. The Laplacian filter 202B includes Laplacianoperators. The Laplacian operator is essentially an approximation to thelinear second derivative of brightness. The operator highlights thepoints, lines and edges of an image and suppresses uniform and smoothlyvarying regions of the image. In one embodiment, the Laplacian operatoris represented by the 3 by 3 matrix shown in FIG. 5A. The 3 by 3 matrix,referred to as a kernel, has a central pixel having a value equal tonegative four which means that the brightness value of the central pixelin the image 105 a is multiplied by negative four. In the Laplaciankernel, the values of the four neighbors touching the sides, above andbelow the central pixel is equal to one. Accordingly, the brightnesslevels of the four nearest neighbors to the central pixel in the image105 a are multiplied by one. Typically, the four neighbors are locatedusing the directions north, east, south and west relative to the centralpixel. However, other orientations are possible (as shown in FIGS.8A–8H).

The specified pixels of the kernel are multiplied by the correspondingkernel coefficient and then added together. Note that, in thisembodiment, the total sum of the Laplacian kernel coefficients equalszero. Consequently in a region of the image 105 a that is uniform inbrightness, or has a uniform gradient of brightness, the result ofapplying this kernel reduces the gray level to zero. However, when adiscontinuity is present, e.g., a point, line or edge, the result of theLaplacian kernel maybe non-zero depending upon where the central pointlies on the discontinuity.

Because the image 105 a can be divided into millions of pixels, and amethod of the invention compares each pixel with its neighbors,processor speed may be effected. However, in an embodiment of theinvention, an option is provided to increase the speed of operation ofthe inspection system by reducing the time to capture and process animage. Specifically, a fill-factor option may be selected to produceonly a partially processed image of the substrate 102. The fill-factoris a multiplier that may be used with a subsequent blob-type operator toarrive at a calculated equivalent area of the image of the substrate102.

The image filtering method performed by the filtering section 202further includes a sharpening step. The sharpening step is implementedby a sharpening filter 202A shown in FIG. 4B. The sharpening filter 202Aimproves the image 105 a by locally increasing the contrast at areas ofdiscontinuity. The sharpening filter can be described as a specific typeof Laplacian filter. As mentioned, the Laplacian operator is anapproximation to the linear second derivative of the brightness (B) indirections x and y, and is represented by the equation:∇² B≡∂ ² B/∂x ²+∂² B/∂y ².  (1.0)The above equation (1.0) is invariant to rotation, and hence insensitiveto the direction in which the discontinuity runs. The effect of theLaplacian operator is to highlight the points, lines and edges in animage 105 a and to suppress uniform and smoothly varying regions. Byitself, this Laplacian image is not very easy to interpret. However, bycombining the Laplacian enhancements with the original image 105 a, theoverall gray scale variation is restored. This technique also sharpensthe image by increasing the contrast at the discontinuities.

The sharpening kernel of the sharpening filter 202A used in oneembodiment of the invention to locally increase the contrast is shown inFIG. 5B. Note that the central weight of the sharpening kernel has avalue of five. In another embodiment of the invention, the centralweight is negative five, and the north, east, south and west neighborsare multiplied by one.

The sharpening kernel, also referred to as a sharpening operator,improves the contrast produced at the edges of the image 105 a.Justification for the procedure can be found in two differentexplanations. First, the blur in an image can be modeled as a diffusionprocess which obeys the partial differential equation:∂ƒ/∂t=κ∇ ²ƒ,  (1.2)where the blur function is ƒ(x,y,t), t is time and κ is a constant. Ifequation (1.2) is approximated using a Taylor series expansion aroundtime T, then one can express the brightness of the unblurred image asB(x,y)=ƒ(x,y,t)−τ∂ƒ/∂t+0.5τ²∂² ƒ/∂t ²−.  (1.4)If the higher order terms are ignored, then equation (1.4) becomesB=ƒ−κ∇ ²ƒ.  (1.6)Accordingly, the brightness of the unblurred image B can be restored bysubtracting the Laplacian (times a constant) from the blurred image ƒ.

A second justification for the procedure can be found using Fourieranalysis to describe the operation of the Laplacian operator as a highpass filter comprising high and low frequency components of the imagebrightness. In this approach, a smoothing kernel is described as a lowpass filter. This low pass filter removes the high frequency variabilityassociated with noise which can cause the nearby pixels to vary inbrightness. Conversely, a high pass filter allows these high frequenciesto remain (pass through the filter) while removing the low frequenciescorresponding to the gradual overall variation in brightness.

Accordingly, the image filtering method performed by the filteringsection 202 of the processor 116 includes a smoothing step. Thesmoothing step is implemented using a smoothing filter 202C shown inFIG. 4B. The smoothing filter 202C is used to reduce the signal to noiseratio associated with the image 105 a. Essentially, the smoothing stepperforms spatial averaging. The spatial averaging adds together thepixel brightness values in each small region of the image 105 a, anddivides by the number of pixels in the neighborhood, and uses theresulting value to construct a new image.

In one embodiment of the invention, the smoothing operator utilized isshown in FIG. 5C. In this embodiment, the value of the central andneighboring pixels in the smoothing kernel are all equal to one.Smoothing is used here to average similarly textured regions to beseparated via subsequent thresholding operations.

Smoothing operations tend to reduce the maximum values and increaseminimum values in the image. Depending on the ratio of bright pixelsversus dark pixels, the resulting image may brighten or darken assmoothing is applied. Performing an unlimited number of smoothingoperations would ultimately result in an image with only one gray level.In this embodiment dark pixels (indicating low frequencies) are moreprevalent, so instead of dividing by nine, the number of pixels used,the sum is divided by eight to effectively boost the smoothed image by afactor of 1.125 after each application or pass such that contrast andbrightness is improved for subsequent thresholding operations. This alsoimproves processing speed by allowing a relatively faster shift-by-3(binary) operation rather than a numerically equivalent but slowerdivision by eight. In this embodiment, the best results are typicallyobserved after six smoothing applications, or passes, as describedabove.

In another embodiment of the invention, one may reduce the signal tonoise ratio by performing a kernel operation. The kernel operation isspatial averaging that is performed by replacing each of the pixels withthe average of itself and its neighbors. In one embodiment of theinvention, a computer program performs the kernel operation andcalculates the above described image morphologies using sharpeningoperators, Laplacian operators, and smoothing operators.

The Acquisition Section 206

In one embodiment of the invention, the processor 116 includes anacquisition section 206 that provides automatic gain and offsets (AGO)used to view or capture the image 105 a. In general, any means to adjustor otherwise enhance brightness, contrast or overall quality of thereal-time image 105 or stored image 105 a, or portions of the image 105a may be applied. Such enhancements may include, but are not limited to,lighting configurations, utilizing optical filters, spatial filters,polarizers, or any method that includes a combination thereof. Theenhancements may further include software manipulation of the pixels inthe image 105 a to provide optical corrections to aberrations,vignetting and lighting.

FIG. 6 shows a flowchart 500 that describes the acquisition section 206of the processor 116 in one embodiment of the invention. The stepsdescribed by the flowchart 500 may be implemented by software in theprocessor 116, hardware components, or a combination of hardware andsoftware. Referring to FIG. 6, system parameters may be set manually orautomatically in step 502, where the system default parameters mayinclude the type of camera 104 being used, and the input voltages tovarious tail locations. Tail locations refer to the left (darkest) andright (brightest) ends, or tails, of a brightness histogram of the image105 a.

Step 504 captures the initial image 105, and a sampling window foranalyzing the image is defined in Step 506. The sampling window may bemanually or automatically defined and is the source of image data forthe calculations performed in steps 508 and 514. Step 508 calculates thegain and offset required to move the left and right tails of the image105 a to predetermined locations. Step 510 performs a second acquisitionbased on information calculated in step 508 to adjust and enhance thehistogram distribution of image data for subsequent operations. In oneembodiment of the invention, Step 510 also performs a linear expansionand shift to further improve the image brightness and contrast of image105 a.

In one embodiment of the invention, experimental results indicate thatinitial limitations may be set as shown in Tables 1 and 2 below whenusing an 8-bit video unit a video frame grabber equipped with a typicalprogrammable Analog to Digital Converter (ADC):

TABLE 1 Initial ADC command values for the Automatic Gain and Offsetfunction. Parameter Offset Gain Initial Command Values 16 127 (for 7.5IRE = 0) (for 100 IRE = 255)

Table 1 shows the initial 8-bit ADC command values that typically allowthe full range of standard video input levels, when digitized, to fullyspan the 8-bit ADC output range without clipping. Note that for a grayscale range from 0 (or 7.5 IRE) to 255 (or 100 IRE) where 100 IRE equals0.714 volts, the initial command values for the offset and gain is 16and 127 respectively.

Table 2 below shows the maximum and minimum range of command values usedto control an input section of the ADC hardware. Also shown areadjustment limitations based on the typical signal-to-noise performanceof the incoming video signal and the expected signal range.

TABLE 2 ADC command value range and limits for the Automatic Gain andOffset function. Parameter Minimum Maximum Command Value Range 0 255Gain Adjustment Limits 40 255 (maximum gain) (minimum gain) OffsetAdjustment Limits 0 150 (brightest offset) (darkest offset)

Table 3 below shows typical target tail locations used by the AutomaticGain and Offset (AGO) function to determine ADC gain and offset commandvalues that, when applied in subsequent acquisitions, tend to limit thetails of similar regions or features of interest to the target values.

TABLE 3 Initial Target Parameters for the Automatic Gain and Offsetfunction. Parameter Left Tail Right Tail Target Tail Locations 63 191for Paste Sample (darkest paste feature) (brightest paste feature)Window Target Tail Locations 15 240 for Full Field of View (darkestfeature) (brightest feature)

In general, the target values are selected that optimize regions orfeatures of interest for a specific image processing task. In Step 508,tail locations 63 and 191 shown in Table 3 are used by the AGO functionto enhance solder paste regions without regard to the validity of othernon-paste image data. Alternatively, the tail locations 15 and 240 shownin Table 3 may be used to provide a full field of valid image data andto allow tails of subsequent acquisitions to drift slightly without lossdue to clipping at each end of the 8-bit gray scale.

In one embodiment of the invention, Step 508 includes clip rangedetection, warning, and corrective methods for RS170/NTSC signalvoltages that exceed approximately 120±3 IRE, or 0.835 to 0.878 volts.Processor 116 automatically adjusts acquisition parameters such thatsignal voltages remain within normal operating range.

Typical RS170/NTSC cameras have output signal clip levels set to 120±3IRE, or approximately 0.835 to 0.878 volts, where 100 IRE equals 0.714volts. If the voltages are over the clip range, a warning message issent indicating that saturation has either occurred or is likely. If thevoltages are below the clip range, then the method proceeds to Step 510.Step 510 administers the newly calculated parameters to acquire anenhanced image 105 a for further processing. Step 512 recalls the samplewindow coordinates defined in Step 506 and applies them to the new imagecaptured in Step 510. Step 514 performs a statistics-based AGO functionon the new sample window to determine optimal run-time acquisition andprocessing parameters. This method of the invention insures that similarstatistical characteristics are produced in paste regions of images thatare acquired at run-time.

In Step 516, the method of the invention determines whether thepreliminary run-time acquisition parameters are within predeterminedhardware and software limits. Also determined in Step 516 is whetherprocessing parameters, including kernel geometry and the effectivesampling rate, are optimized to provide the maximum level ofperformance. If not, then the appropriate system parameters are adjustedin Step 518, and new parameters are inserted at Step 510. Steps 510through 516 are then repeated. Once the run-time parameters aredetermined they are saved in memory at Step 520 and the method of theinvention terminates.

A histogram that shows the effects of the AGO in section 206 of theprocessor 116 is shown in FIGS. 7A–7B. Referring to FIG. 7A, a histogramof the original image of a printed circuit board 220 having solder paste102 deposited thereon is shown. The x-axis of the histogram representsthe gray levels from 0 to 255, and the y-axis represents the number ofimage pixels at each gray level. FIG. 7B shows a histogram of the sameimage with paste contrast enhanced. FIG. 7B also shows a considerablenumber of non-paste pixels clipped at 255. In one embodiment of theinvention, the left tail of the original image equals fifteen, and theright tail equals 240 on a gray scale level that extends from 0 to 255(implying an 8-bit gray scale). In another embodiment of the invention,Step 502 allows the processor 116 to automatically calculate and setinitial acquisition parameters, or alternatively allows an operator toset the parameters. In another embodiment of the invention, the step ofsetting the AGO (step 502) allows an operator to manually set theacquisition parameters, or allows the processor 116 to automaticallycalculate and set the parameters.

As mentioned, Step 510 acquires a new image 105 a to enhance the regionof interest, in this case solder paste, based on parameters calculatedin Step 508. In one embodiment of the invention and referring to FIG.7B, the gray levels for the left tail and right tail of the enhancedimage 105 a occur at 15 and 255. In one embodiment of the invention andreferring to FIG. 7B, the gray levels for the left tail and right tailof the adjusted image occur at 15 and 255 as a second pass is performedon the image 105 a in step 510 to enhance the region of interest, inthis case solder paste, based on parameters calculated in step 508. Thecalculation performed by the acquisition section 206 of the processor116 produces a linear expansion and shift of the solder paste regionsuch that the solder paste region of interest occurs between tails 63and 191. FIG. 7B also shows an increased number of pixels at gray level255 due to clipping of values that would otherwise exceed 255 when theparameters calculated in step 508 are applied.

Comparing FIG. 7A and FIG. 7B, a reduction in height of the y-axis inareas designated as paste reflects the redistribution of an equal numberof paste pixels over more gray levels.

Analysis Section 210

The locator analysis section 210 of the processor 116 is used todetermine the location of solder paste relative to the predeterminedcontact regions 224. Coordinates of each area may be determined usingcentroids, blob techniques, correlation, and a variety of other searchtools. The process of utilizing blob techniques and centroids is wellknown and discussed by John C. Russ in “The Image Processing Handbook,Second Edition”; pages 416–431,487–545, and in the “Handbook of ComputerVision Algorithms in Image Algebra”, by Gerhard X. Ritter and Joseph N.Wilson; pages 161–172 which are incorporated herein by reference.

The results of the location analysis are used to detect the presence,absence, and alignment of the paste, and thus alignment of the stencil16 with the desired contact regions 224. Results also provide the basisfor other adaptive and corrective process control measures. In oneembodiment of the invention, information provided by the locator section210 is used to modify operational parameters of the dispenser head 118.

Anti-Aliasing of the Solder Paste Image (Process Control Section 212)

The process control section 212 of the processor 116 is used to minimizeany aliasing in an image of the solder paste region 102 a. In obtaininga digitized image 105 a of the solder paste region 102 a deposited on asubstrate 102, several conditions unique to solder paste texturerecognition are considered. Specifically, in one embodiment of theinvention, the grain size of the paste and its effect on the quality ofthe image 105 a at various magnifications. Ordinarily, as long as thesampling rate is above the Nyquist frequency aliasing may be averted.However, when imaging solder paste regions, aliasing can also occurwithout the proper relationships between grain size, focal length,magnification, and the CCD pixel spacing. In one embodiment, the texturerecognition method of the invention considers four types of solder pasteshown in Table 2 4 below.

TABLE 4 The types of solder paste used and the various grain sizes.Solder Paste Nominal Grain Diameter Type 3 35.0 μm 1.3780 mils Type 429.0 μm 1.1417 mils Type 5 20.0 μm 0.7874 mils Type 6 10.0 μm 0.3937mils

In general, different types of solder paste often vary in grain size.Table 2 4 lists the nominal grain sizes associated with the varioustypes of solder paste. In one embodiment of the invention, the variationin grain size results in a minimum magnification with which the solderpaste deposit 102 a may be viewed sampled effectively by a CCD camera104.

If a set of system magnifications (measured in microns or mils perpixel) is selected so that each of the solder paste types shown in Table4 is sampled at the Nyquist limit, then a table of compatiblemagnifications can be created as shown below in Table 5.

TABLE 5 Compatible system magnifications for various types of solderpaste where X indicates compatible magnification and the systemmagnification is shown in microns (μm) and mils per pixel (mpp). 5.0 μm10.0 μm 14.5 μm 17.5 μm 0.1969 mpp 0.3937 mpp 0.5709 mpp 0.6890 mpp Type3 X X X X Type 4 X X X — Type 5 X X — — Type 6 X — — —

In theory, the Nyquist limit is the highest frequency, or in this casethe smallest grain size, that may be accurately sampled at a givensystem magnification. The Nyquist limit may be defined as half of thesampling rate.

As discussed, the method of solder paste texture recognition relies onthe unique neighborhood features and statistics of solder paste thatwhich are pronounced when the image is in sharp focus. In one embodimentof the invention, optical and imaging hardware is utilized to accuratelysample the paste texture. In that embodiment, the sampling frequency ofthe paste particles is below the Nyquist limit of the system to avoidaliasing. Alternatively, magnification is generally limited so that theunique frequency characteristic of the solder paste is not lost, andwhere limited aliasing is acceptable, since the resultantcharacteristics of the image data, specifically in paste regions, maystill be used to detect evidence of the paste.

In one embodiment of the invention, the performance of the processor 116is optimized within an appropriate range of magnification by applying afrequency dependent kernel size and shape. Neighborhood pixels that liean appropriate distance from the primary pixel (usually the centralpixel) can manually, or automatically be selected based upon spatialfrequency of the paste particles. By adjusting the geometry of theprocessing kernels in this manner, the effective sampling rate can beadjusted to accommodate various paste types. In one embodiment of theinvention, the sensor sampling frequency is proportional to thereciprocal pixel center to center spacing measured in cycles permillimeter, and the highest frequency that may be accurately sampled isone-half the sensor sampling frequency. The magnification may also bedescribed as a function of the pixel distribution patterns used tocapture or process the image of the solder paste regions.

FIGS. 8A–8H show various pixel distribution patterns used to recognizethe solder paste deposits over a region. The pixel distribution patternsrepresent sample kernel configurations for paste texture spacingconfigurations. The pixel distribution pattern used for magnificationdepends upon the grain size of the solder paste. In FIGS. 8A–8B and8E–8F, the pixel distribution pattern shows the central pixels andneighboring pixels touching. In FIGS. 8C–8D and 8G–8H, the centralpixels and neighboring pixels are shown separated by various distances.The distances are represented by diameters (measured in microns andmils) of a circle centered on the central pixel. The radius correspondsto the effective pixel spacing, or the sampling rate. Therefore, thediameter represents the Nyquist limit, or the minimum theoretical pastegrain size that can be sampled effectively using the indicated kernelgeometry. The distances are represented by the diameters (measured inmils) of a circular region of interest. In one embodiment of theinvention shown in FIGS. 8A–8D, each pixel represents 0.6621 mils, andthe circled regions of interest vary in diameter from 1.3242 mils to3.7454 mils. In FIGS. 8E–8H, each pixel represents 0.4797 mils, and thecircled regions of interest vary in diameter from 0.9594 mils to 2.7136mils.

Kernel configurations are not limited to those shown in FIGS. 8A–8H and,in general, no connectivity between the pixels is required.

Experimental Results of Texture Recognition

As discussed above, one embodiment of the invention uses a combinationof statistical and morphological operations on a digitized image toseparate areas of solder paste texture areas from other feature-richnon-paste areas on a printed circuit board, stencil, wafer, or anysubstrate. FIGS. 9A–9D show the results of a system that utilizes anembodiment of the invention.

Shown in FIG. 9A is raw image data, with no saturation, of a printedcircuit board 802 having solder paste areas 804 and non-paste featuresdistributed thereon. The raw image shows a well-defined edge 806 thatoutlines a circuit trace 808 leading to a contact region 810, and awell-defined separation line 812 that begins the contact region.

In FIG. 9B, the results of a processed image using the method of theinvention is shown. The processed image reveals a, solder bridge 814 notseen in FIG. 9A. Note that the non-paste features including edge 806,trace 808, contact region 810, and separation line 812 shown in FIG. 9Aare shown as white areas in the region of interest 816, while the solderpaste regions 818 are shown as black. Since in the output image thepresence of solder paste is represented by a black region, any regionthat is not totally black or white indicates a scalable transitionalregion at paste edges or some other area of uncertainty at thatlocation. Accordingly, the gray scalable regions 820 improve the abilityto accurately report the location and area of small paste deposits whereedges constitute a large percent of the total area and, under certainconditions, is more tolerant of variations in image quality, brightness,and contrast.

Shown in FIG. 9C is the raw image, with saturation, of the same printedcircuit board 802 having solder paste areas 804 and non-paste featuresdistributed thereon. The raw image shows the same well defined edge 806that outlines a circuit trace 808 leading to a contact region 810.However, the well-defined separation line 812 shown in FIG. 9A, and thegray level representation of trace 808 and the contact pads 810, areindistinguishable in FIG. 9C. FIG. 9C also shows a blemish 822 on theprinted circuit board not observed in any of the previous images.

FIG. 9D is the raw image, with saturation, processed utilizing themethod of the invention. The processed image shown in FIG. 9D reveals asolder bridge 814. The non paste features 816 are shown in FIG. 9D aswhite, paste edges 820 and areas of uncertainty in gray, and the solderpaste regions 818 are shown as black and represent areas in which 100percent solder paste is detected. Note that non-solder paste regions,including the blemish 822 shown in FIG. 9C, on the substrate are ignoredwhen the method of the invention is applied. The gray levels arescalable areas that represent regions that lie between the non-essentialfeatures on a printed circuit board and the solder paste deposits. Thegray scale information allows proportional accounting of edge pixels andany areas of uncertainty. Accordingly, the scalable gray areas conveymore information to an observer regarding the quality of the solderpaste contact region than a binary image that is either black or white.

FIGS. 10A–10C and FIGS. 11A–11C provide a comparison of images from asystem that utilizes an embodiment of the invention. FIG. 11A shows thesame raw image of FIG. 10A except with saturation. The raw images areprocessed utilizing the method of the invention. The processed imagesmay be made binary, i.e., black or white, by application of a singlethresholding technique, or the processed images may have a scalable grayrange by application of a dual thresholding technique. As previouslydescribed, dual thresholds make it possible to appropriately account fortransitional regions at paste edges and other areas of uncertainty.Accordingly, the method of the invention improves the ability of qualitycontrol software programs to accurately report the area of small pastedeposits where edges constitute a large percent of the total area, andthe method of the invention is more tolerant of variations in imagequality, brightness, and contrast.

FIGS. 10A–10C show a series of ball grid array (BGA) images forcomparison between a raw image without saturation when single and dualthreshold processes are performed on the image. FIG. 10A shows anunprocessed raw BGA image 1002 without saturation, and an array ofpredetermined contact pads 1004. FIG. 10B shows the results of a singlethreshold process performed on the raw BGA image shown in FIG. 10A. FIG.10C shows the results of a dual threshold process utilizing scalablegray levels performed on the raw BGA image shown in FIG. 10A. Edges andregions of uncertainty are in shades of gray. One region of uncertaintyappears at 1006.

FIGS. 11A–11C show a series of BGA images for comparison with the rawBGA image 1002 with saturation when a single threshold process and adual threshold process are performed on the image. FIGS. 11A–11C alsoserves as a comparison of images from a ball grid array (BGA) from asystem that utilizes an embodiment of the invention with saturation.FIG. 11A shows an array of predetermined contact pads 1004, and anunprocessed raw BGA image 1002 with saturation. FIG. 11B shows theresults of a single threshold process performed on the raw BGA image1002 of FIG. 11A. FIG. 11C shows the results of a dual threshold processutilizing scalable gray levels performed on the raw BGA image of FIG.11A. Edges and regions of uncertainty are in shades of gray. The sameregion of uncertainty 1006 appears in both FIG. 10C and FIG. 11C.

FIGS. 10B–C and FIGS. 11B–C show that the method of the invention istolerant of significant image brightness and contrast variations innon-paste features, including non-linear brightness changes, and dataloss due to saturation or drop-out of non-paste features.

FIG. 12 shows a histogram 1200 of the smoothed results of a system thatutilizes an embodiment of the invention. The histogram is divided intothree regions: a non-paste region 1202, a transition region 1204, and asolder paste region 1206. The histogram 1200 shows a distribution ofpixel brightness which corresponds to the texture in the smoothed image.In one embodiment, the smoothed image depicts paste as white andnon-paste as black. Accordingly, paste pixels 1206 favor the right endof the histogram and non-paste pixels 1202 favor the left end.Transitional pixels 1204 corresponding to an edge in the image is shownin the area between the paste and non-paste regions. In anotherembodiment of the invention, the smoothed image is inverted to depictpaste as black and non-paste as white.

Bridge Detection Methods

FIG. 13 is a flowchart of a prior art process for inspecting solderpaste deposited on a substrate. As an initial operation, the image of asection of the board is acquired, such as by an area or line scan camera(step 1300). FIG. 14 is an illustrative example of an image acquired instep 1300 of FIG. 13. FIG. 14 is a grayscale image of solder paste. Theimage acquired in step 1300 is processed so that regions of the boardthat are covered with paste are more easily identified (step 1310). Forexample, a paste detection (also referred to as paste recognition)process is performed on the image to separate solder paste fromnon-paste features (e.g., the conductive pads, the substrate) creating anew “paste-only” image (steps 1310 and 1330). FIG. 15 is an illustrativeexample of a weighted paste-only image based on paste detection appliedto the image of FIG. 14. The resulting image is not necessarily analyzedduring paste detection at this stage to determine the quantity,location, or significance of paste deposits. Instead, a separate process(step 1340) may be used to analyze the paste-only image.

Many different techniques can be used to separate the solder paste fromnon-paste information. One known technique is thresholding, which can beused to divide an image into sections based on brightness or some otherparameter, such as visibility under a type of light. A single threshold(or brightness level) is chosen to create a binary image depicting pasteand non-paste regions. Threshold techniques segment an image intoregions of interest and removes all other regions that are outside ofthe threshold and are thus deemed not essential. For example, afluorescent dye can be added to solder paste so that only the paste isvisible under a particular type of light. FIG. 16 is a Red Green Blue(RGB) image of UV entranced fluorescent paste, and FIG. 17 is a binarypaste-only image from a “blue” light channel, using a “single threshold”method. Dual threshold methods work similarly but include a scalabletransition region of brightness levels between thresholds to moteaccurately account for edge pixels. The dual threshold method issometimes preferred over the single threshold, since small pastefeatures can contain a relatively significant amount of edge data.

Another known technique for paste detection is image subtraction.Subtraction methods create a “difference image” by subtracting one imagefrom another. Some subtraction-based paste detection methods comparedifferences between a reference image and a newly captured image todetect paste. In some instances, these images must be registeredprecisely to each other before subtraction to minimize error. Arelatively significant amount of computer storage, data retrieval, andmemory buffer capabilities may be needed to accommodate the manyreference images. Ideally a complete set of reference images need onlybe acquired once, but in doing so, performance can be adversely affectedby typical variations found between otherwise identical substrates. Toavoid such problems, new reference images can be acquired for eachsubstrate to be inspected, but this can slow the process considerablyand may be inappropriate for use in a high-speed production environment.Variations of the thresholding and/or image subtraction techniques mayinclude use of laser profiling to create a topographical image, andx-ray techniques. These and other methods are intended to betterseparate paste from non-paste regions for subsequent analyses.

One drawback that can occur with thresholding and image subtraction isthat brightness levels of the solder paste and the background can oftenoverlap. This overlapping can make it difficult, if not impossible, toeffectively separate the solder paste images from backgroundinformation. In addition, area and location of paste deposits cannot bedetermined with certainty under such conditions thus limiting the valueof statistical process control (SPC) data and adaptive controlresponses.

One reason for identifying solder paste areas on a printed circuit boardis to detect solder defects, such as bridges. In solder paste printingoperations, the term “bridge” can describe a print defect where someamount of stray paste spans (or nearly spans) the gap between adjacentpads, or where some amount of stray paste spans a gap between padsbeyond predefined limits. Bridges can be significant because, atcritical dimensions, a bridge of solder paste may fail to pull backduring subsequent reflow operations, causing a short or other relateddefect in the final assembly. Bridges are not the only type of printand/or paste defects. Other defects, such as excess paste, poor printdefinition, and poor alignment also can increase the probability thatsimilar defects, especially “shorts”, may appear at the location of theoriginal defect later in the assembly process.

One approach to increasing the yields associated with the solder pastedeposition process is to detect print defects immediately after theprint operation and reject defective boards before the placement ofelectronic components. This enables surface mount technology (SMT)manufacturers to save time otherwise wasted in the assembly of defectiveboards and avoids costly rework. Whether or not a defect is reported atany specific site, SPC data can be collected and used to monitor andcorrect undesirable trends before they become critical to the process.

Assessment of bridges, bridge-like features, and other print defects canbe a subjective task with few hard rules or limits. Subjectivedescriptions of print defects such as “bridge,” “bridge-like,” “too muchpaste” may be viewed as subjective descriptions of print defects.Without further technical assessment, it is difficult to use any or allof these subjective descriptions to predict whether a defect, such as abridge-related defect, will appear later in a given process, or toindicate the presence of a process trend where the probability of such adefect is increased.

Some known techniques used to detected bridges, such as so-called simple“blob” and “bounding box” techniques, as well as bridge-detectiontechniques that rely solely on the area of the paste in a region ofinterest (e.g., a gap between pads), can be subject to binary “noise”and may provide little information about the geometry or actualsignificance of features within the “box” or region of interest.Further, paste-in-gap limits must often be set relatively high to avoidfalse detection. None of these methods can consistently and reliablydetect partial bridging or bridge-like tendencies for use in effectiveand preventative print process control.

As described, the solder paste texture recognition method can be used todetect particular defects that occur on a substrate, such as bridges. Insolder past print operations, bridges or bridge-like features can occurwhen a relatively well-defined deposit of paste spans (or nearly spans)the gap between pads, or when a deposit of paste goes beyond predefinedlimits. As the span of a paste feature increases across the gap, so doesthe significance of the feature to the process. A so-called “classic”bridge would span the entire gap, but span alone does not guarantee thata related defect will occur later in the process. Something less thanfull span could be equally troublesome, or equally benign. Additionalcharacteristics must be considered to gauge the true significance of adefect to the process.

Although sections along a bridge may be narrow or “weak”, or itsbridge-like geometry poor, it has been found that the probability thatbridging will occur at some point during subsequent reflow operations isdependent on the amount, location, and geometry of paste involved. Asthe area covered by the paste feature increases, so does the probabilitythat the paste will cause a bridge-related defect when sufficient spanexists across the gap.

The thinnest point along the bridge feature, its so-called “weakestlink,” may indicate an ability or tendency of the bridge to break andpull back during subsequent reflow operations. If a section along thebridge is sufficiently narrow, the probability that the paste will breakand pull back from this point may be greater than the probability of adeposit that remains relatively (or critically) wide at its narrowestpoint. As the width or “bulk” of the paste feature increases so does theprobability that the paste feature may cause a bridge-related defect,provided a sufficient span exists across the gap and the total amount ofpaste forming the bridge is sufficient to maintain it during subsequentreflow operations.

Another type of print defect is a so-called “general” print defect.General print defects occur when the total quantity of paste, regardlessof shape or location in the gap, is beyond predefined limits. Whengeneral print defects are detected, an actual paste bridge need not beconfirmed, and no further characterizations of the defect are requiredto make a decision that a substrate is defective. General print defectconditions indicate generally poor print quality, poor alignment,bridging, or all of these, with an increased probability that abridge-related defect (e.g., a short circuit) may appear at the locationof the print defect later in the assembly process. For generalpaste-in-gap defects, a user-defined limit is applied to the total areaof paste found in the gap.

The precise inspection of bridges can be a critical tool not only forthe detection of many common SMT print defects, but also for correctingundesirable trends in the process. Since a relatively insignificantpaste-in-gap area can provide significant bridge geometry across thegap, and vice versa, both paste-in-gap and span measurements are neededto reliably determine the true significance of bridge-like, features toa process.

One embodiment of the invention provides systems and methods for gapdefect analysis that provides reliable paste-in-gap area measurement anddetects significant geometry and span of bridge-like paste features asthey relate to the surface mount technology (SMT) assembly process. Inone embodiment, the total amount of paste in a gap and the effectivespan of bridge-like features across the gap are used together todetermine the probability that a specific paste feature will cause abridge-related defect.

FIG. 18 is a flowchart of a print defect detection sequence, inaccordance with one embodiment of the invention. The invention can usean image acquired in virtually any manner (step 1800), as long as theimage is (or can be) suitably segmented into a “paste-only” image (step1810). The image can be what is commonly referred to as a “digitized”image. The paste-only image, also referred to herein as a “processedimage”, can, for example, be a binary image or may have weighted graylevels to appropriately account for transitional regions at edges andother areas of uncertainty. Use of various image enhancement techniques,including so-called “leveling” or “field flattening” techniques, can beapplied to the acquired image during the first stages of processing toultimately improve the fidelity of the resulting paste-only image.

In at least one embodiment of the invention, the paste-only image usesweighted pixels. Use of weighted pixel values improves the ability ofthe bridge analysis of the invention to accurately report area and thusthe significance of small paste deposits where edges constitute a largepercent of the total area and, under certain conditions, is moretolerant of minor variations in image quality, brightness, and contrast.In addition, use of weighted pixel values can achieve more accuratebridge detection results, particularly in small gap areas containingrelatively few pixels or sample points. In one embodiment of theinvention, a pre-determined look-up table, such as a 256 element lookuptable, can be used to effectively weigh pixels during creation of thepaste-only image 1810, at run-time, without requiring highly repetitive,redundant, run-time math operations.

“Paste-only” images can be created via the methods described previously,including but not limited to direct application of single or dualthresholds to an acquired image, image subtraction techniques, and thetexture based segmentation technique described herein. Other usabletechniques for creating paste-only images, as described previously,include use of UV-dye enhanced paste, laser profiling, use ofinterferometry to create 2D representations of topographical data (i.e.,an image of “volume elements”, or “voxels”), and x-ray techniques. Thoseskilled in the art will appreciate that many methods now known and to bedeveloped in the future for producing segmented paste-only images areusable in at least some embodiments of the invention.

Referring again to FIG. 18, within the paste-only image (step 1810), aregion of interest is defined (step 1820). The region of interest, inone embodiment, is a region in which it is desired to know the amountand characteristics of a substance deposited therein. For example, on aPCB, wafer, stencil, or similar substrate this region of interest may bethe gap between pads or apertures where the presence of bridge orbridge-like features is undesirable. FIGS. 19A–19C and 20A–20C,described below, illustrate run-time and paste-only images showing a“region of interest”.

FIGS. 19A–19C are details of a run-time image with illustrativefeatures, including an example of a region of interest, in accordancewith an embodiment of the invention. FIGS. 19A–19C illustrate enlargedviews of a bridge-like feature 1900 in the solder paste 1903, andseveral typical non-paste (board) features. FIG. 19A is an enlarged viewof a first portion of the run time image shown in FIG. 19B, and FIG. 19Cis an enlarged view of a second portion of the run time image in FIG.19B, including the bridge-like feature 1900 and solder paste 1903. Thenon-paste features include, for example, a bare board 1906, a bare trace1910, the mask 1915 on the trace 1910, and the bare pad 1920. FIGS. 19Aand 19B also illustrate a gap 1920 between a first solder pad 1925 and asecond solder pad 1930. In this example the solder paste 1903 is shiftedto the right of the first solder pad 1925, into the gap 1920.

FIGS. 20A–20C are corresponding paste-only views of the images shown inFIGS. 19A–19C, respectively. FIGS. 20A–20C are illustrative examples ofpaste-only images created in accordance with the texture based methoddescribed herein. As mentioned, texture-based images are but one exampleof a plurality of suitable paste-only images. In FIG. 20, the possiblebridge-like feature 1900 is circled.

Referring again to FIG. 18, the paste only image of FIG. 20B can be usedfor step 1810 and the gap region of interest 1920 shown in FIGS. 19A and20A can be used for step 1820, in at least one embodiment of theinvention. However, it is possible in at least one embodiment to reversesteps 1820 and 1810—that is, to define the region of interest in theacquired image, then create a paste-only image of the region of interestonly. Doing so may save processing time. In at least one embodiment ofthe invention, the paste-only conversion of step 1810 is performed overa region no bigger than that required to include all sub-regions asdefined in step 1820.

In step 1850, a projection and sliding average method (see FIG. 21 andrelated discussion, below) is used on the suitably segmented paste-onlyimage to ultimately detect and analyze significant bridge or bridge-likefeatures within the specified region of interest. In addition, userdefined inputs are set in step 1827, described in FIG. 22 and relateddiscussion. These user defined inputs help to measure the area of thepaste on pad (step 1830) and the paste in the gap (step 1840), and toanalyze the bridge feature (step 1850).

Referring briefly to FIG. 22, which is a general block diagramillustrating the inputs and outputs of a system 2200 implemented inaccordance with an embodiment of the invention, several user definedinputs 2210 are shown. These include the maximum amount of paste allowedin the gap 2215, the subjective “sensitivity” setting of the bridgedetection system 2220, and the maximum allowable span of a significantbridge feature across a gap 2225.

The maximum amount of paste allowed in the gap 2215 represents what theuser specifies as the maximum amount of paste that can be in a gapbefore the quantity of paste is taken to indicate a significant printdefect. For example, this can be expressed as a percent of the nominalgap area, such as 55%, meaning that up to 55% of the nominal gap areacan be covered by paste before a paste-in-gap defect is said to occur.These numbers are purely illustrative.

The “sensitivity” setting 2220 is used to calculate the size of asliding average window (a.k.a. the smoothing kernel) in step 2230, andultimately determines the degree of smoothing, or filtration, applied toprojected data as described later. This allows users to specify theminimum width, or “bulk”, of a bridge feature to be considered in spanmeasurements in relative terms, and is preferred. Alternatively, theuser could enter the “sensitivity” in more direct units, includingpixels, mils, and microns. In the embodiments of the invention describedherein, the width of the smoothing kernel 2230 and thus the minimumwidth of a feature considered to be a bridge feature is measured inpixels, such as 5 pixels wide, 10 pixels wide, etc. These numbers arepurely-illustrative and will, of course, vary depending on the level ofbridge detection sensitivity desired.

The maximum allowable span of a significant bridge feature across a gap2225 represents what a user specifies to be the maximum amount that afeature, such as a bridge feature, can extend across a region ofinterest, such as a gap between pads. For example, this can be expressedas a percent of the gap, such as 70% of the width (or length) of a gap,in a direction parallel to the “bridging” axis. This number is purelyillustrative.

The size of a sliding average window 2230 is the size of theone-dimensional smoothing kernel, which is used in at least oneembodiment of the invention to smooth projected values of a gap. Thisprovides a localized average at each point along the projection whileremoving a corresponding level of fine detail not considered to besignificant to the process. This feature is described further herein. Asan example, the size of a sliding average window can be measured inpixels, e.g., 5 pixels. In at least one embodiment, the size of thesliding average window 2230 is based at least in part on the minimumwidth of a feature to be considered to be a significant bridge feature.The sensitivity settings of step 2220 are in relative terms (e.g., low,medium, high) that ultimately determine the width of the slidingaverage, in pixels, in step 2230.

Referring again to FIG. 18, the paste-on-pad area measurement of step1830 is a straightforward measurement of the amount of paste foundwithin a slightly enlarged region of interest surrounding a pad. This isa 2-dimensional surface area measurement, known to those skilled in theart, and similar to the general paste-in-gap area measurement.Paste-on-pad area measurement is the simplest and most universallyapplied prior art used for paste inspection. It is included here as partof the preferred mode of operation, since it shares the same paste-onlyimage and can be used together with the gap area and bridge analysesdescribed in this invention to provide a more comprehensive set of datafor control of the print process. Otherwise, the measurement of thepaste-on-pad area (step 1830) in the region of interest is independentof the general paste-in-gap area measurement (step 1840) and bridgefeature measurement (step 1850). The paste-in-gap area measurement (step1840) is compared to the user-defined input of maximum amount of pasteallowed in the gap 2215. Thus, steps 1830 and 1840 are used to helpdetect general print defects (described previously) in the region ofinterest. If a general print defect is detected, the substrate beinginspected may be immediately rejected.

Bridge features in the region of interest are analyzed in step 1850.FIG. 21 is a flow chart of a process for the bridge feature analysis ofstep 1850, in accordance with an embodiment of the invention. In FIG.21, to estimate the significance of bridge-like features a pair ofperpendicular axes is assigned to the region of interest (step 2100), sothat the paste-only images can be first projected onto one axis of theregion of interest. For example, FIGS. 23A–23C are first illustrativerun-time image, paste-only image, and a plot of the projected paste onlyimage of solder paste in a gap (the gap is specified as the region ofinterest for illustrative purposes only), processed in accordance withan embodiment of the invention. FIG. 23A is an illustrative example of aregion of interest that is a “run-time” image of paste in a gap (whichwould correspond to, for example, step 1800 of FIG. 18 followed by step1820 of FIG. 18). FIG. 23B is a paste-only image of the run-time imageof FIG. 23A. This is the sliding, or moving, average. A new array iscreated by smoothing the initial projected values by the specifiedkernel size. The resulting numbers represent the effective span of thepaste at each point along the gap.

As an aside, note that, in FIG. 23B, the paste coverage in the gap isdetermined to be 45% in step 2215.

Referring again to FIGS. 21 and 23A–C, FIG. 23C is a plot with X andY-axes corresponding to the dimensions of the gap region pixel. TheY-axis corresponds to the typically longer “non-bridging” axis of thegap, and the X-axis corresponds to the “bridging” or “span” axis of thegap. Of course, these axes may be reversed depending on which is the“bridging” axis. In step 2110, the paste in the region of interest isconverted to a single dimensional array 2305 effectively aligned withone axis of the gap and perpendicular to the span or “bridging” axis.This single dimensional array is created, in one embodiment, by what iscommonly known by those skilled in the art as a simple “projection” ofpixel data along one axis of the region of interest. For example,looking in FIG. 23B along the length of the gap, in this case the Y-axisat about location 38, all of the pixels across the gap span are addedtogether. That total number is divided by 255, the maximum 8-bit graylevel, to get an equivalent span in pixels at this location along theY-axis. This value is plotted along the X-axis in FIG. 23C at a point inthe gap span of about 12 pixels, or about 75% of the way across the 16pixel-wide gap.

The single dimensional array 2305, or projection, is then smoothed tofilter out small irregularities caused by relatively weak or otherwiseinsignificant bridging geometry. Smoothing is a process by which datapoints are averaged with their neighbors in a series, such as a timeseries, or image of pixels, to reduce or “blur” the sharp edges andabrupt transitions in the raw data. In one embodiment, the smoothingstep 2120 is done by passing a sliding average 2310 (with sizedetermined by user defined/specified parameters; see FIG. 22) over theraw projected data to get a smoother equivalent span at point along theprojection. The sliding average is effectively a one-dimensionalsmoothing kernel. The degree of smoothing is based on the size of thekernel and is analogous to the minimum width of a significant bridge orbridge-like feature. It is not necessary, however, for the size of the,smoothing kernel to be the same as the minimum width of a significantbridge or bridge-like feature. The example in FIG. 23 uses a slidingaverage, or smoothing kernel, of 5 pixels. Taking the average of any 5consecutive entries of the projection as one side of a rectangle, andthe size of the smoothing kernel, or 5, as the other side, a rectangle2310 can be drawn to represent a functionally equivalent bridge featureat each point along the length of the region of interest. The smoothedresults represent the effective span of these “instantaneous” bridgefeatures along the length of the gap, and it is these values, in percentof total gap width, that are checked during step 2140 (FIG. 21), againstuser-defined limits 2225 (FIG. 22).

For example, in FIG. 23C, the sliding average 2310 has a user-specifiedwidth of 5 pixels, which is the same as the minimum width of bridgefeature. The sliding average 2310 is passed along the single dimensionalarray of projected data from a top to bottom direction relative to theimage shown in FIG. 23C (of course, the direction could be reversed, andif the projection of the gap is vertical, then the sliding average couldbe passed from right to left or left to right). The number of elementsused in the sliding average (the size of the smoothing kernel), togetherwith the smoothed results and with other user-specified information,enables a functional estimate of area and significant geometry offeatures along the length of the gap.

Referring again to FIG. 21, in step 2140, the maximum value of asmoothed single dimensional array is first located. Predeterminedthresholds (see 2225 of FIG. 22, and graphic representation 2320 of FIG.23C), which are also user specified, are then applied to the maximumvalue to determine whether any features “met” or exceed these limits,and if so, a bridge-like defect is detected by definition. For example,in FIG. 23C, the threshold is applied to determine whether any part ofthe smoothed projection exceeds the user-defined limit 2320, or 70% ofthe gap. In this example, 5 smoothed values or “hits” 2330 were found tobe above the threshold 2320, the locations of which are marked with barssimilar to 2310, for illustration. Of course, the threshold and slidingaverage width (in pixels) shown in FIG. 23C is purely illustrative, andother numbers are usable. Based on the application of the thresholds,possible bridges and/or bridge-like features are identified (step 2140)and returned to step 1850 of FIG. 18.

FIGS. 24 and 25 provide additional examples of embodiments of theinvention, showing application of the smoothing and thresholding asdescribed in FIG. 21. FIGS. 24A–24D are second illustrative run-time,paste-only, region of interest, and plot of projected paste-only imagedata, respectively, of solder paste in a gap, processed in accordancewith an embodiment of the invention. In FIG. 24D, the sliding averageused is 10 pixels, and the double line 2410 in FIG. 24D shows a plot ofthe single dimensional array 2405 after smoothing has been applied. InFIG. 24D, it is seen that a single feature meets the requirement ofbeing classified, by definition, as a “bridge like” defect, where themaximum smoothed value is above the user-defined limit

FIGS. 25A–25C are third illustrative run-time, paste-only, and projectedpaste only images of solder paste in a gap, processed in accordance withan embodiment of the invention. In FIG. 25C, the minimum width of abridge or bridge-like feature is 10 pixels and the user-definedthreshold is 70%. These user-defined parameters are the same as in FIG.24. A relatively substantial solder bridge is visible in FIGS. 25A and25B. In FIG. 25C, the sliding average extends beyond the user-definedthreshold, and does so over a relatively large length of the gap at the70% threshold line. This graphically illustrates the presence of astrong bridge-like defect with many smoothed values exceeding thethreshold, although only one, the maximum value, is required to indicatea bridge-like defect.

In at least one embodiment of the invention, the sliding average can bemodified to provide similar sliding root mean square (RMS) output, wheredata points along the projection are squared before the local mean(sliding average) is calculated. The “root” of these “mean squares” isnearly identical to the simple sliding average values. However, thesliding average may be more advantageous because it requires minimalcalculation.

Referring briefly again to FIG. 18, after the-analysis of step 1850 iscomplete, the results can be compared against predetermined (such,asuser defined) process limits (step 1860), with the resultant data stored(step 1870) for possible modifications to the screen printing/solderpaste placement process. Whether or not process limits are exceeded or adefect is reported at any specific site, the data can be appropriatelyfiltered and used to monitor lesser trends for effective control of theprint process (step 1880), as will be appreciated by those skilled inthe art. For example, the minimum, maximum, and average amount of pastefound in gaps between pads can be saved after inspection is complete(e.g., inspection of a given substrate). The same measurements can besaved for span measurements of bridge-like features. This data not onlyenables trend analyses for effective process control, it provides ameans to fine tune detection parameters based on historical performanceand realistic production requirements.

The user specified inputs of FIG. 22 are, in at least one embodiment,partially dependent on features of the substrates, such as variations ingap size, pad size, and pad position. For example, in the exampleembodiments of FIGS. 23, 24, and 25, it also can be seen that the userspecified minimum width of a bridge/bridge-like feature can varydepending features such as, the length and width of the gap and on theuser specified threshold. This is because the inherent surface tensionof substances such as molten solder paste can cause the solder paste to“pull back” and not extend across a gap if the width of the projectionis small as compared to the size of the gap, even if the projectionextends more than halfway across a gap. Thus, for the example gap spanof 9 pixels in FIG. 25C, a larger minimum width of possiblebridge/bridge like feature (i.e., 10 pixels) is specified. So, forexample, a feature having a width of 9 pixels might be permitted toextend up to 90% of the width of the gap in the example of FIG. 25C,because the tendency of the solder paste is to pull back and not“bridge”.

In contrast, for the example gap-span of FIG. 23C (i.e., 16 pixels), theminimum width of a bridge feature is 5 pixels. In this example, if thebridge feature extends across 70% or more of the span of the gap, it isunlikely to “pull back” and more likely to “bridge.”

FIG. 26 is an illustration showing the effect of variations in pad sizeon gap size, in accordance with an embodiment of the invention, and FIG.27 is an illustration showing the effect of variations in pad positionon gap size, in accordance with an embodiment of the invention. As FIGS.26 and 27 illustrate, the gap size can vary depending on the pad sizeand pad placement. Because at least some embodiments of the inventionpermit user specified inputs for parameters such as maximum span of asignificant bridge feature across a gap, size of sliding average window,etc. (see FIG. 22), the systems and methods of the inventionadvantageously may be quickly adapted to substrates of varying sizes,with varying pad sizes and placements.

FIGS. 28–30 are representative illustrations showing types of bridgesand bridge-like features that may be detectable using one embodiment ofthe invention. All bridge-like features are precisely drawn to coverexactly 6%, 18%, and 36% of the total gap area in FIGS. 28, 29, and 30,respectively, regardless of shape. Only the geometry of bridge-likefeatures is changed to demonstrate how various shapes affect theprobability that a bridge defect will occur later in a process called“reflow”, where the solder paste is heated to a molten state, thusenabling redistribution of the solder deposit via surface tension. Ofcourse, naturally occurring bridge-like features would be more randomlyshaped, but they would share most of the basic characteristics shown inthese illustrations. Only FIG. 28 is described in detail in thefollowing paragraphs, although the same descriptions apply to likefigures in FIGS. 29 and 30.

In FIG. 28, item 2800 shows a bridge-like paste feature that extends thefull span of the gap between two adjacent pad deposits, making contactwith both, in what can be called “classic” bridge geometry. The bridgefeature 2802 has uniform thickness across the full span of the gap, withno part any more likely to break and “pull back” via surface tensionduring subsequent reflow operations. During reflow operations, surfacetension would create a tendency to “wick” the molten solder, previouslya solder paste, back toward junctions 2804 and 2806, both tending tobroaden to the point of contact 2804 and 2806, and thinning the centerof the bridge feature. Eventually, under certain conditions, the featuremay become thin enough to break and pull back with each portionmigrating toward respective “junctions” 2804 and 2806.

The maximum value produced by the sliding average of the projected data,as described in this invention, is dependent on the size of the slidingaverage, i.e., the smoothing kernel. In a preferred method, the size ofthe sliding average is determined by a user-defined “sensitivity”setting. For a specific kernel size, or given sensitivity, the size andshape of the bridge feature determines how much of an effect thesmoothing kernel will have on the projected data and thus the maximumvalue after smoothing. The maximum value can be considered the effectivespan of features with at least enough “bulk” or “power” to survive thesmoothing operation. Referring briefly again to FIG. 24, an actualbridge feature can be seen in 24B that is similar in relative size andshape to the bridge example 2802, so it will be used here to show, inactual practice, the effect of smoothing similarly shaped bridge-likefeatures. Both features span 100% of the gap. FIG. 24D shows a plot 2410of the smoothed data with a maximum value of about 85% at the bridgelocation. The feature is flagged as a defect if the maximum smoothedspan, in this case 85%, is above the user-defined limit.

FIG. 28 shows a uniform bridge feature 2810 making contact with only onepad deposit at 2814. In this case a “break” 2812 is already present,therefore the probability of “pull back” is greater in 2810 than in2800, since surface tension favors only one side, with no counteractionfrom the opposite side. Note that the point of contact 2814 with the paddeposit is slightly larger than that of junction 2804, as required tomaintain the same 6% gap coverage for all bridge examples shown in FIGS.28A–F. Given the same bridge “sensitivity”, the effect of smoothing theprojected data of 2810 would be-similar to the previous example 2800,since they have nearly the same uniform thickness, but the effectivespan (i.e. maximum smoothed value) would be less than in the previousexample. Again, the feature is flagged as a defect if the maximumsmoothed span is above the user-defined limit.

FIG. 28, item 2820, also has a “break” 2822, similar to 2812, butlocated mid-span.

FIG. 28, item 2830, is similar to item 2800 in that contact is made onboth sides of the gap. Shape is the main difference here with a broaderbase of contact 2834 on one side of the gap, and a much smaller point ofcontact 2836 on the other. The point 2836 would provide little of the“wicking” tendencies that the much larger base 2834 would provide. Also,upon similarly smoothing the projected data of bridge features 2832 and2802, the effective span (maximum of smoothed values) of the triangleshaped feature 2832 would be less than that of the uniformly shaped2802. The difference in effective span correctly implies that 2802 hasmore significant bridge potential than does 2832, and although bothreported spans must be checked against the user-defined span limits,feature 2832 is less likely to be flagged as a defect than 2802. FIG. 29includes items 2900, 2910, 2920, 2930, 2940, and 2950. FIG. 30 includesitems 3000, 3010, 3020, 3030, 3040, and 3050. FIGS. 29 and 30 presentbridge-like features in nearly identical format as in FIG. 28 with onenotable difference. While all bridge features shown in FIG. 28 coverexactly 6% of the gap, in FIG. 29 they cover 18% of the gap, and in FIG.30, 36%. Upon smoothing the projected data of like bridge features inFIGS. 28, 29, and 30, using the same kernel, the effective span of thelarger deposits would be greater. Again, the difference in effectivespan correctly implies that relatively larger deposits have moresignificant bridge potential than do smaller deposits, and although allreported spans must be checked against the user-defined span limits,larger ones are more likely to be flagged as a defect. In addition,general paste-in-gap area must also be checked against the user-definedlimits, and while these are typically set to catch gross defects thatmay also have significant bridge potential, here too the larger depositsare more likely to be flagged as a defect than the smaller ones.

FIG. 31 is a representative illustration of other types of screenprinting/solder paste printing defects that may be detectable inaccordance with at least some embodiments of the invention. FIG. 31,item 3100 shows a common print defect due to poor general pastealignment In this case reported paste-in-gap values would rise with thedegree of misalignment, as would the reported span of paste across thegap. FIG. 31, item 3110 shows the effect of gross misalignment For thepurpose of estimating future bridge potential, this invention wouldcorrectly estimate the increased potential of a bridge related defect asa function of paste alignment.

FIG. 31, items 3130 and 3140, show multiple unique defects where lengthof span and shape of the feature determine defect potential. In item3130 both features extend to mid-gap, although from opposite sides, andboth cover the same amount of gap area. This method of this inventionoperates on both features simultaneously and, as first demonstrated inFIG. 28, the rectangular feature would correctly produce the largest gapspan after smoothing operations. The same is true for similar featuresin item 3140, although the maximum reported span would be greater, andthus the bridging potential, in this example.

FIG. 31, items 3120 and 3150, show slight and gross over-printrespectively. In both cases, the effective span of paste across the gapis greatest near the center of the gap. Only the cumulative effect ofpaste in the bridging direction is important. In this way, the simpleprojection and sliding average method used in this invention is able tocorrectly determine that item 3150 has greater bridging potential thandoes item 3120, based on the difference in reported effective span.Also, the reported paste-in-gap area would be greater for item 3150 thanfor item 3120, thus item 3150 would be first to correctly indicate apaste-in-gap defect on this account as well.

FIGS. 28–31 and associated descriptions demonstrate the methods used inthis invention to correctly estimate the effective “bridging potential”of a paste deposit, based on user-defined “sensitivity” parameters, aswell as to detect and flag bridge defects that may adversely affectsubsequent processes, based on user-defined limits.

It has been found that the methods for detection of defects such asbridges is more successful when accurate and reliable paste detectionmethods are used to separate paste from background. Advantageously, thetexture-based paste detection method disclosed herein and in applicationSer. No. 09/304,699 may be combined with the bridge analysis techniquedisclosed herein to provide useful and reliable measurement of bridgecharacteristics that are relevant to the board assembly process.

In describing the embodiments of the invention illustrated in thefigures, specific terminology is used for the sake of clarity. However,the invention is not limited to the specific terms so selected, and eachspecific term at least includes all technical and functional equivalentsthat operate in a similar manner to accomplish a similar purpose.

As those skilled in the art will recognize variations, modifications,and other implementations of what is described herein can occur to thoseof ordinary skill in the art without departing from the spirit and thescope of the invention as claimed. Further, virtually any aspect of theembodiments of the invention described herein can be implemented usingsoftware, hardware, or in a combination of hardware and software.

It should be understood that, in the Figures of this application, insome instances, a plurality of system elements or method steps may beshown as illustrative of a particular system element, and a singlesystem element or method step may be shown as illustrative of aplurality of a particular systems elements or method steps. It should beunderstood that showing a plurality of a particular element or step isnot intended to imply that a system or method implemented in accordancewith the invention must comprise more than one of that element or step,nor is it intended by illustrating a single element or step that theinvention is limited to embodiments having only a single one of thatrespective elements or steps. In addition, the total number of elementsor steps shown for a particular system element or method is not intendedto be limiting; those skilled in the art will recognize that the numberof a particular system element or method steps can, in some instances,be selected to accommodate the particular user needs.

Although the invention has been described and pictured in a preferredform with a certain degree of particularity, it is understood that thepresent disclosure of the preferred form, has been made only by way ofexample, and that numerous changes in the details of construction andcombination and arrangement of parts may be made without departing fromthe spirit and scope of the invention as hereinafter claimed.

1. A system for dispensing material at a predetermined location on asubstrate comprising: a dispenser that dispenses material on thesubstrate; a camera configured to take an image of the substrate; and acontroller for maintaining the operations of the dispenser, thecontroller being programmed to: perform texture-based recognition of amaterial deposit located on the substrate, define a region of interestwithin the image of material, the defined region of interest having afirst axis, wherein a set of pixels in the image lie along the axis,compute, for each pixel along the axis, a sum of all the pixels in theregion of interest that are in perpendicular alignment with therespective pixel along the axis, represent the sums of each pixel alongthe axis as a single dimensional array perpendicular to the axis, andevaluate the single dimensional array to determine whether any defectsexist in the region of interest.
 2. The system of claim 1 wherein thesubstrate is a circuit board.
 3. The system of claim 1 wherein thedefects include short circuits, bridges, excess quantities of material,stray areas of material, and poorly defined areas of material on thesubstrate.
 4. The system of claim 1 wherein the controller is furtherprogrammed to compute, for each defect in the region of interest, thearea and geometry of the defect, using a detection parameter and thesingle dimensional array.
 5. A stencil printer for dispensing materialat a predetermined location on a substrate, the stencil printercomprising: a frame; a substrate support, coupled to the frame, tosupport a substrate; a stencil, coupled to the frame, having at leastone aperture to receive a material to be deposited through the apertureonto the surface of the electronic substrate; a dispenser, coupled tothe stencil, to dispense material on the substrate; a controller tomaintain the operations of the substrate support, the stencil and thedispenser; means for performing a texture-based image of a materialdeposit located on the substrate; means for defining a region ofinterest within the image of material, wherein the means for defining aregion of interest within the image of material comprises defining afirst axis, wherein a set of pixels in the image lie along the axis;means for determining whether any defects exist in the region ofinterest; means for computing, for each pixel along the axis, a sum ofall the pixels in the region of interest that are in perpendicularalignment with the respective pixel along the axis; and means forrepresenting the sums of each pixel along the axis as a singledimensional array perpendicular to the axis.
 6. The stencil printer ofclaim 5, wherein the defects includes short circuits, bridges, excessquantities of material, stray areas of material, and poorly definedareas of material on the substrate.
 7. The stencil printer of claim 5,further comprising means for computing, for each defect in the region ofinterest, the area and geometry of the defect, using a detectionparameter and the single dimensional array.